SIPLACE D2 � Speed Placement Machine With its two gantries, the SIPLACE D2 is the solution for high speed and high flexibility production. With the SIPLACE head modularity, stay flexible with the choice of two 12 and/or 6-nozzle C&P heads.
SIPLACE D3 � Multi Functional Placement Machine The SIPLACE D3 with its three gantries can place up to 30,100 components per hour and can be equipped with a SIPLACE TwinHead. That makes the SIPLACE D3 a fast and flexible all-rounder that can even pl
SIPLACE D4 � High-Speed Placement Machine The four-gantry SIPLACE D4 is equipped with four fast 12-nozzle Collect & Place heads that have been improved for higher robustness and reliability. The machine can place up to 66,000 components per hour w
SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)
The ultimate SMT production line. Among electronics manufacturers, the SIPLACE X-Series is considered the benchmark wherever maximum speed and absolute precision are required (mobile phones, tablets, notebooks, LED placement, etc). Put its top-of
The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio
User friendly operating software, Ultra stable diode-pumped Nd :YAG green laser, Support Wafer Size : 4,5,6 & 8" wafers, option : 8 to 12" wafers, Absolutely free from damage on the fabricated wafer, High accurate marking position alignment using th
Tesla solves the challenge of thin wafers, power dissipation and current/voltage requirements. The broad use of power semiconductors has created a pressing need to characterize power devices quickly and efficiently. Cascade Microtech�s new Tesla on-w
» Fully automated 200 / 300mm EFEM wafer capability » Patented vibration squeegee technology » Dual or Single load port available Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Pri
» Combined system technology (wafer printer and wafer bumper) » Unsurpassed vibration squeegee printing technology » Robust design to ensure years of dependable operation The SemiTouch Wafer Printer / Bumper is an easy to use, highly robust semi-auto
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