New SMT Equipment: sips (Page 1 of 3)

EBSO

EBSO

New Equipment |  

Selective Wave Soldering system

SIP Technology Co Ltd

SI-P850 Solder Paste Printer

SI-P850 Solder Paste Printer

New Equipment | Printing

This high efficiency unit is capable of a wide range of consumer or industrial applications. High Performance and Cost Effective, Flexible Changeover and Capable of M/L size PWB's for Flexibility, Optional PCB support up to 27.6" X 16" or 20" X 18",

Sony Manufacturing Systems America, Inc

Through-Hole Equipment

New Equipment |  

VCD (All Makes) Dip Inserters Sip Inserters Wavesolder systems (Single & Dual) Radial Inserters

ATEX International Corporation

Resistors

New Equipment |  

General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)

NIC Components Corp.

Discontinued semiconductor packaging

New Equipment |  

Packaging of discontinued semiconductor devices (when die are available)in all packaging styles such as DIP, SIP, SOIC, SMT, etc.

EMS Microelectronics Division

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Software for SMT

High Precision Fluid Dispensers
convection smt reflow ovens

High Throughput Reflow Oven
Void Free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications


Low-cost, self-paced, online training on electronics manufacturing fundamentals