The SP-1 is an in-line 100% 2D and sampled 3D solder paste inspection system designed for SMT manufacturers. The SP-1 provides highly accurate and repeatable measurements of stencil offset and skew, as well as solder paste area, height and volume.
New Equipment | Test Equipment
The AMIQ04 is a dual channel modulation generator engineered for use as an I/Q source for use with complex communication systems. It is programmed and set with WinIQSIM or can be operated from an SMIQ series signal generator. Each channel of the AMIQ
New Equipment | Test Equipment
The AMIQ04 is a dual channel modulation generator engineered for use as an I/Q source for use with complex communication systems. It is programmed and set with WinIQSIM or can be operated from an SMIQ series signal generator. Each channel of the AMIQ
TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as
TM 150 series solderable conductive adhesives is rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, and so on, to replace conductive adhesives (Ag) or solder materials suc
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up. The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection equipment for electronic device ma
Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature
Improve test coverage and reduce cost. The XJTAG XJLink2-CFM adds the power of XJTAG’s boundary scan solution to the Teradyne TestStation, giving test access to hard-to-probe parts of a board. Both JTAG and non JTAG devices, such as Flash, RAM, Eth
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