New SMT Equipment: skewed (Page 1 of 2)

SP-1

New Equipment |  

The SP-1 is an in-line 100% 2D and sampled 3D solder paste inspection system designed for SMT manufacturers. The SP-1 provides highly accurate and repeatable measurements of stencil offset and skew, as well as solder paste area, height and volume.

MVT

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

XJLink / XJLink2 — USB 2.0 to JTAG interface

XJLink / XJLink2 — USB 2.0 to JTAG interface

New Equipment | Software

XJLink and XJLink2 are small, portable, USB hardware devices that provide a high speed interface (480Mbps) to the JTAG chain on a circuit board. The small, lightweight design means the XJLink or XJLink2 can easily be moved to the Unit Under Test (UUT

XJTAG

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

FX-940 AOI - Automated In-line PCB Inspection

FX-940 AOI - Automated In-line PCB Inspection

New Equipment | Inspection

1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

M1m AOI - Automated Optical Inspection for Microelectronics

M1m AOI - Automated Optical Inspection for Microelectronics

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

M1 Series AOI - In-Line Automated Inspection

M1 Series AOI - In-Line Automated Inspection

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

TM 230 Solderable Conductive Adhesives

TM 230 Solderable Conductive Adhesives

New Equipment | Materials

TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as

YINCAE Advanced Materials, LLC.

Rohde & Schwarz AMIQ04 -B1-B3-K11 Modulation Waveform Generator

Rohde & Schwarz AMIQ04 -B1-B3-K11 Modulation Waveform Generator

New Equipment | Test Equipment

The AMIQ04 is a dual channel modulation generator engineered for use as an I/Q source for use with complex communication systems. It is programmed and set with WinIQSIM or can be operated from an SMIQ series signal generator. Each channel of the AMIQ

Recon Test Equipment Inc.

Rohde & Schwarz AMIQ04-B3 Modulation Waveform Generator

Rohde & Schwarz AMIQ04-B3 Modulation Waveform Generator

New Equipment | Test Equipment

The AMIQ04 is a dual channel modulation generator engineered for use as an I/Q source for use with complex communication systems. It is programmed and set with WinIQSIM or can be operated from an SMIQ series signal generator. Each channel of the AMIQ

Recon Test Equipment Inc.

  1 2 Next

skewed searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

High Throughput Reflow Oven
ISVI High Resolution Fast Speed Industrial Cameras

World's Best Reflow Oven Customizable for Unique Applications
PCB Handling Machine with CE

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
PCB Handling with CE

Wave Soldering 101 Training Course
Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

Training online, at your facility, or at one of our worldwide training centers"
PCB separator

"Heller Korea"