JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
New Equipment | Solder Paste Stencils
Laser cut stainless steel Adhesive Stencil for adhesive printing. Adhesive stencils are used to solder SMD components with a solder wave, whereas the components are fixed with an adhesive. The adhesive spots are print in one printing process by usin
Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st
Petroferm offers a complete line of cleaning chemistries for use in immersion ultrasonic cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards and production fixtures, as well
New Equipment | Component Counters / SMD Counters
Electronic counter for taped axial, radial and SMD taped components. Since May 2008 with new feature of a multiplier to count taped SMD component with sizes of 0402 or even 0201. Furthermore has the EBSO counter new machine diagnostic features and i
TP45N can release all SMD units including 0201 ,SOIC PLCC BGA to QFPIC(o.5mm foot spacing) ��Automatic centering system: The 4 side claws can fit for all SMD component like 0402, SOIC, PLCC��QFP IC�� ��High precision pole system ��Vision centering s
The PA908.500 series is our newest fully automatic pick & place machine. They are capable of placement rates up to 5000 CPH*, and can place all standard SMD components from 0402�s to BGA�s and QFP�s. With feeders on all 4 sides they have a capacity
New Equipment | Solder Materials
Epibond® 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond®are high-quality non-slumping and non-stringing surface mount
CAT90-M is a manual pick and place system featuring the latest high resolution vision technology. The system is designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pitch QFP’s, and many other SMD’s. Components
Petroferm offers a complete line of aqueous, semi-aqueous, and manual solvent cleaning chemistries for removing raw solder paste and surface mount adhesives from stencils and misprinted boards both by hand and in stencil cleaning equipment. HYDREX A
