High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
New Equipment | Rework & Repair Equipment
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo
The new eMIS Management Software Suite for SMD production includes functions for job planning, feeder setup optimization, stock management, traceability, operational data analysis, line management and much more. With eMIS, managers and operators can
The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor th
The AV862 Series of AOI solutions from ASC International provides manufactures with a solid platform to validate the overall variables associated with component placement. Absence / presence, polarity, OCR, solder inspection and lead quality can all
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an
