Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Model name :HP-520SPI Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various PCB Clamping options depend on PCB t
Quick Overview Application of WZ-1202 and WZ-1206 : thick film circuit, pressure sensor (piezoresistive type, capacitance type), glass glazed potentiometer, dielectric antenna, ceramic metallization, microwave oven magnetron RFID, automobile oil lev
Our new labelers offer a combination of features not found in competitive systems. Our machines: 1. utilize �Print on Demand� which means reduced labor, and, no worries about waste, scrap or lead times associated with preprinted labels. We have mod
MODEL NAME: HP-350MD ; HP-620MD Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various PCB Clamping options depend
MODEL NAME :HPX-1300S - LED Screen Printer with 2D Inspection Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Variou
MODEL NAME:HP-350M ;HP-520S ; HP-680S ; HP-850S ; HP-1000S Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various P
ESE screen printers outperform high-end models from the best-known manufacturers, yet cost less. The advanced-design printers are manufactured in Korea to the highest quality standards. All major components are controlled by high-precision servo moto
New Equipment | Board Handling - Storage
Stentech's Vacuum Plates provide support for the circuit board during the assembly process. Because we now manufacture highly complex and dense boards, this has become critical to avoid warping, sagging, and bending of the board. Vacuum plates wil
SemiPack's capabilities range from fully automatic to manual processing; extensive cropping and forming capabilities; active and passive component processing; axial to radial lead forming servicing; and snap-in and stand-off forms. For SMT processi
