New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
New Equipment | Education/Training
BEST IPC J-STD-001 training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This training ki
New Equipment | Education/Training
BEST IPC J-STD-001 Revision F training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This
New Equipment | Education/Training
This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new
TP45N can release all SMD units including 0201 ,SOIC PLCC BGA to QFPIC(o.5mm foot spacing) ��Automatic centering system: The 4 side claws can fit for all SMD component like 0402, SOIC, PLCC��QFP IC�� ��High precision pole system ��Vision centering s
Chips, SOIC's, SSOP's, SOJ's, PLCC's, BGA's, socket's, QFP's, Odd form devices, connectors, switches and any custom components.
High-density SRAM, Flash, EEPROM, and DRAM in BGA, QFP, SIMM, DIMM, PLCC, flatpack, ZIP, SOIC, DIP, and other packages. PC Cards. High-reliability packaging for extreme environments and military applications.
Packaging of discontinued semiconductor devices (when die are available)in all packaging styles such as DIP, SIP, SOIC, SMT, etc.
