New Equipment | Education/Training
This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Han
LIGHTSPEEDMFG provides quick-turn BGA services including rework and reballing. It's our specialty! We're your best choice for rework, reballing, inspection, ECOs and upgrades, for BGA, CGA, �BGA, and other component types. Our advanced BGA rework
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridges. The 2K Series improve
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
New Equipment | Solder Materials
Ceasolder-PAL (Pink Acrylic Latex) Peelable Acrylic Latex Solder Mask Ceasolder-Pal is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Unli
The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
Reliable optical inspection of wave, reflow, pre-reflow and selective soldering. More than an entry into AOI Optimal, ergonomic loading through large opening angle Superior resolution, reliable 01005 and fine-pitch inspection Scalable camera t
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
