New SMT Equipment: solder ball (Page 1 of 16)

PLC Action Quickly Laser Tin Ball Spraying Soldering Machine , Length 1070±5mm

PLC Action Quickly Laser Tin Ball Spraying Soldering Machine , Length 1070±5mm

New Equipment | Soldering Robots

PLC Action and PC Picture Processing Optional Quickly Laser Tin-Ball Spraying Soldering Machine Product Parameter : Feeding Way Carry in or out track or on-line type or jig, single or double station Lase

ChuangWei Electronic Equipment Manufactory Ltd.

Power Optional 50-200w Laser Solder Ball Spraying Soldering Machine,CWLS-01

Power Optional 50-200w Laser Solder Ball Spraying Soldering Machine,CWLS-01

New Equipment | Soldering Robots

Feeding Way: Carry In Or Out Track Or On-line Type Or Jig, Single Or Double Station Laser Parameter: Power Optional 50-200w Wave Length : 1070 Pattern: Constant Or Pulse Solder Ball Size: ø0.25MM Controlling Way: PLC Action

ChuangWei Electronic Equipment Manufactory Ltd.

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

DEK Galaxy SMT Stencil Printer

DEK Galaxy SMT Stencil Printer

New Equipment | Pick & Place

DEK Galaxy SMT Stencil Printer Maximum printing surface: 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface: 510 mm* (X) x 508.5 mm (Y),

Qersa Technology Co.,ltd

BGA Reballing Service

BGA Reballing Service

New Equipment | Rework & Repair Services

BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Reballing Fixture, Hi Yield

BGA Reballing Fixture, Hi Yield

New Equipment | Rework & Repair Equipment

Custom made reballing fixtures designed for your specific component.  Allows for high yield reballing of multiple parts at one time.  Use for ball attach to BGA components and for solder bumping of LGA's and QFN's.  Simply send us the data sheet and

Precision PCB Services, Inc

BGA Rework Training & Certification

BGA Rework Training & Certification

New Equipment | Education/Training

This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the

Precision PCB Services, Inc

Siemens 12mm 16mm original feeder 00141092

Siemens 12mm 16mm original feeder 00141092

New Equipment | Components

http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ

Flason Electronic Co.,limited

Automatic FR4 PCB Separator High Effect Depanelizing from Damage

Automatic FR4 PCB Separator High Effect Depanelizing from Damage

New Equipment | Depaneling

1. For electronics, cell phones, computers, PCB, FPC (flexible printed circuit board),LED. 2. Mold make of SKH-11 Steel, Blade is SKH-9(From Japan), rigorous Job!!!! Dedicated  to high strength cutting, and excellent toughness, able to cut metal boar

ChuangWei Electronic Equipment Manufactory Ltd.

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