New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m
Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m
New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
The AIP is a new Windows NT based Image Processor that surpasses all current industry standards. New functionality includes: * Automatically detects solder balls and voids. * Automatically corrects xray image distortion using dual calibration met
