Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
New Equipment | Assembly Services
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with
This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m
Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
