Tool for Wire Bonding (Ball Bonding)
New Equipment | Solder Materials
Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien
Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
New Equipment | Rework & Repair Equipment
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo
New Equipment | Assembly Services
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with
This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.
New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
