New SMT Equipment: solder ball bond (Page 6 of 12)

Advanced Image Processor (AIP)

New Equipment |  

The AIP is a new Windows NT based Image Processor that surpasses all current industry standards. New functionality includes: * Automatically detects solder balls and voids. * Automatically corrects xray image distortion using dual calibration met

Nicolet Imaging Systems

KappRad - The Radiator Repair Solder

KappRad - The Radiator Repair Solder

New Equipment | Solder Materials

KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app

Kapp Alloy & Wire, Inc

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

Tacky Assembly Flux

Tacky Assembly Flux

New Equipment |  

Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and

Hallway International Trading Co.,Ltd.

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

FX-940 AOI - Automated In-line PCB Inspection

FX-940 AOI - Automated In-line PCB Inspection

New Equipment | Inspection

1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

SOLDER MEISTER UNIX-410S High Performance Soldering Robots

SOLDER MEISTER UNIX-410S High Performance Soldering Robots

New Equipment | Soldering Robots

The premium model that achieves fast, precise, and high-quality soldering operation. Offering two slim types of high performance soldering robots that letting our customers choose the best one to fit their objectives. Both come with a clean cut feed

Japan Unix Co., Ltd.

Interactive Ball Grid Array Assembly Inspection And Defect Guide

Interactive Ball Grid Array Assembly Inspection And Defect Guide

New Equipment | Inspection

This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for

ASKbobwillis.com

AuSn Solder Electroplating

AuSn Solder Electroplating

New Equipment | Solder Materials

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl

Micralyne Inc.

Galvanite - The lead free galvanizing repair rod

Galvanite - The lead free galvanizing repair rod

New Equipment | Solder Materials

Galvanite solder is a lead-free formulation designed specifically for high quality repairs to galvanized steel surfaces. Galvanite is simple, effective and easy to use, in both manufacturing and field applications. Just like the original galvanizing,

Kapp Alloy & Wire, Inc


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