New SMT Equipment: solder ball ipc-610 (Page 2 of 8)

BGA Rework & Micro BGA Rework Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.

I-Source Technical Services, Inc.

BGA ReBalling System

BGA ReBalling System

New Equipment |  

Don't throw your BGA's away, re-ball them with the Waveroom Plus Reballing system. This is a very user friendly system that is being used extensively by Contract Assembly houses. There are other systems, most much more expensive than this. None work

Waveroom Plus

Easy re=place - Bga Rework machines

Easy re=place - Bga Rework machines

New Equipment |  

Ball grid array placement and soldering The Etneo "easy re=place" is a system for the easy placement and soldering of any SMT components. The system has an exclusive and unique solution to easy and quickly determine the correct soldering profile

Etneo Italia spa

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

ChipFlo

New Equipment |  

Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly

Research International

SMT Solutions

New Equipment |  

We are a Re-balling company based in Chihuahua, Chihuahua.Our core business is the Salvage and Recovery of Electronic Components.Also we offer technical consulting and training in SMT and Wave Soldering.

SMT Solutions

BGA Reballing

BGA Reballing

New Equipment |  

Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package

Artek Manufacturing Inc

Solder Spheres

Solder Spheres

New Equipment | Solder Materials

Solder Balls... Solder Spheres... Whatever you may call it, we think it is the perfect soldering package. We consider it the ultimate solder preform for solder attach, rework / reballing of PIP, POP, PBGA, or Flip Chip… The relative low cost and indu

EasySpheres LLC

Symbion S36 Post-Reflow 3D AOI system

Symbion S36 Post-Reflow 3D AOI system

New Equipment | Inspection

Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT environments. Superior Detection with DPIX™ 3D Technology Symbio

Orpro Vision GmbH

Circuit Board, SMT, OEM Turnkey Service

Circuit Board, SMT, OEM Turnkey Service

New Equipment |  

PCBA , Printed Circuit Board Assembly, PCB Assembly , EMS pcba, Electronic Manufacturing OEM PCBA Tronixlink PCB Assembly line includes the latest process in SMT and wave soldering along with SIP, AOI, X-ray, ICT and functional testing. Our SMT capab

Tronixlink PCB PCBA


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