New SMT Equipment: solder ball joint strength (Page 1 of 6)

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

BP 256 Ball Attach Adhesive

BP 256 Ball Attach Adhesive

New Equipment | Materials

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During

YINCAE Advanced Materials, LLC.

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

Low Melting Type BGA Solder Ball

New Equipment |  

Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m

CCT Europe BV

eBall Lead-Free Solder Spheres

eBall Lead-Free Solder Spheres

New Equipment | Solder Materials

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch

Nihon Superior Co., Ltd.

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

New Equipment | Solder Materials

95% Tin / 5% Antimony a.k.a. "Antimonial Tin" is a Lead solder replacement for soldering electrical equipment, Copper tubing, and cooling coils for refrigerators. Joints are of moderate strength where the higher strength and higher cost of KappZapp™

Kapp Alloy & Wire, Inc

SMT 256B Solder Joint Encapsulant

SMT 256B Solder Joint Encapsulant

New Equipment | Materials

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes

YINCAE Advanced Materials, LLC.

SMT 266 Solder Joint Encapsulant

SMT 266 Solder Joint Encapsulant

New Equipment | Materials

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat

YINCAE Advanced Materials, LLC.

SMT 256EP Solder Joint Encapsulant Paste

SMT 256EP Solder Joint Encapsulant Paste

New Equipment | Materials

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and

YINCAE Advanced Materials, LLC.

KappZapp7R Rosin-cored Solder

KappZapp7R Rosin-cored Solder

New Equipment | Solder Materials

KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c

Solder Direct

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