New Equipment | Cleaning Equipment
clean wiper roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Specifications:
Fine Line Stencil is committed to delivering the highest quality laser stencils in the industry. SLIC™ Stencils Electroformed (ElectroLaser™) Stencils Advanced laser technology for your SMT stencil needs Squeegee Blades Buy FCT A
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
PROwave working in conjunction with the PROfiler datalogger monitors and reports all the critical parameters of your wave soldering process. Simply send PROwave through your wave soldering machine and accurate measurements of key process parameters a
��High agility: it is convenient for TB680LF to control every soldering technical parameter and a high quality could be ensured. ��Digital display of soldering temperature. ��High reliability: high temperature sintering heating element make the mach
New Equipment | Selective Soldering
The ECOSELECT soldering system is the optimal solution for small to medium volume production needs. With the option to operate the system inline or off-line, the ECOSELECT excels in versatility. Over the last 15 years, Ersa has placed more than 100
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
