New SMT Equipment: solder ball quality (Page 5 of 32)

ESE US-X Series Screen Printers

ESE US-X Series Screen Printers

New Equipment | Printing

ESE screen printers outperform high-end models from the best-known manufacturers, yet cost less. The advanced-design printers are manufactured in Korea to the highest quality standards. All major components are controlled by high-precision servo moto

Equipment Services LLC

HC20 Selective Soldering Systems

HC20 Selective Soldering Systems

New Equipment | Selective Soldering

High volume, fully automated Superb quality soldering on top fillet SMEMA passline, horizontal soldering Six individual FLIP units in solder bath Individually programmable on soldering time & soldering height.

Tamura H.A. Machinery, Inc.

63/37 or 60/40 or 55/45 Solder Wire

New Equipment |  

High quality solder wire for both hand and automatic soldering. Available in solid wire and single core with rosin and organic fluxes.

Aoki Laboratories Ltd. [Solder Products Supplier]

BGA Optical and X-Ray Inspection Posters

BGA Optical and X-Ray Inspection Posters

New Equipment | Inspection

Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3

ASKbobwillis.com

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

BGA Socketing Systems

New Equipment |  

Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he

Advanced Interconnections Corporation

Advanced Image Processor (AIP)

New Equipment |  

The AIP is a new Windows NT based Image Processor that surpasses all current industry standards. New functionality includes: * Automatically detects solder balls and voids. * Automatically corrects xray image distortion using dual calibration met

Nicolet Imaging Systems

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

Tacky Assembly Flux

Tacky Assembly Flux

New Equipment |  

Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and

Hallway International Trading Co.,Ltd.

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH


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