Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
New Equipment | Solder Paste Stencils
Dry Film Solder Application SolderMask, Inc. continues to apply Dry Film Solder Mask (DFSM) on Printed Circuit Boards (PCB) since opening for business in 1985. SolderMask, Inc. works with all DFSM available in the United States. Some of the DFSM ma
New Equipment | Rework & Repair Equipment
MLT provides laser services for selective solder mask removal as a precise and controlled rework option. No more scrapping or tedius hours to rework selective areas to recover simply unwanted solder mask. This same process works from many other mat
New Equipment | Solder Materials
Ceasolder-PAL (Pink Acrylic Latex) Peelable Acrylic Latex Solder Mask Ceasolder-Pal is a temporary, peelable solder mask comprised of a thixotropic, synthetic acrylic latex designed to withstand fluxing, wave soldering and cleaning operations. Unli
New Equipment | Solder Materials
Liquid Photoimageable Solder Application Since the introduction of Liquid Photoimageable Solder Masks (LPSIM) in the late 1980's, SolderMask, Inc. has continued to be the premier service-bureau applying it to PCB's. SolderMask, Inc. was the first
New Equipment | Solder Materials
Soldering Flux, Paste & Wire supplies from Kester, BonKote, Circuit Works, Techspray, Start International, Chemtronics, Xuron Bar Solder Flux & Thinners Flux Pens Solder Mask Solder Paste Solder Wire
New Equipment | Solder Materials
Soldering materials: Soldering wires Soldering pastes Stencils Soldering shots Soldering balls Fluxes Rosin liquid and gel fluxes Fluxes residues do not cause corrosion http://www.selen.hr/pokaz_kategorie.php?cid=9
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
Polyimide masking discs have 1.2~1.5 mil of silicon adhesive which does not leave any residue. It can withstand temperature up to 280℃. Applications: Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering, transformer
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