New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
7000 N / S Series Automatic Dispensing Robots Robotic Dispensing Systems Description: The application in filling, adhesive, moulding and sealing which need to inject adhesive and sealant. CW Multi-axis system and on line dispens
Quick and Efficient PCB Singulation When considering the numerous methods available for PCB singulation, it is difficult to decide which might be the best. At ChuangWei we propose that our PCB routers are the most efficient, and quickest way to sing
Double station Automatic PCB Router Machine for The Best Depaneling Solution Specification: Model CW-F01-S Standard working area 320*320mm(standard) Power 220V, 4.2KW Manipulator Repeatability ±0.
When considering the numerous methods available for PCB singulation, it is difficult to decide which might be the best. At ChuangWei we propose that our PCB routers are the most efficient, and quickest way to singulate PCB's. For stress free depaneli
When considering the numerous methods available for PCB singulation, it is difficult to decide which might be the best. At ChuangWei we propose that our PCB routers are the most efficient, and quickest way to singulate PCB's. For stress free depaneli
Features: This PCB Separator adopt x,y,z servo motor and driving system and ball screw ,linear guide rail ,ensure machine run smooth and precisely.moving accuracy less than 0.05mm, routing accuracy less then 0.05mm. Rotary do
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
Printers; Pick'n'Place; Reflow;Soldering; Conveyors & Material Handling; AOI; Odd form Placement; X-Ray & Rework; Precision Cleaners;ESD furniture;Fixtures/Pallets; Laser Marking; Inserters; Profilers; Solder Paste & flux;
