New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Cleaning Equipment
smt stencil clean roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Most MPM pr
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
Used on SMT machinery i.e. DEK, MPM, EKRA, Panasonic etc., to clean residual solder paste
Don't throw your BGA's away, re-ball them with the Waveroom Plus Reballing system. This is a very user friendly system that is being used extensively by Contract Assembly houses. There are other systems, most much more expensive than this. None work
Ball grid array placement and soldering The Etneo "easy re=place" is a system for the easy placement and soldering of any SMT components. The system has an exclusive and unique solution to easy and quickly determine the correct soldering profile
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
The Microbond line of die attach solder pastes are the best in the industry. Available in RM and NC vehicle systems. Special grades allow for greater metal loading which results in fewer voids under the die.
