New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
High Speed and High Precision printer equipped with "Motion Screen." "Motion Screen" fixes printing position by moving the screen. The printer realizes high-accuracy positioning and high-speed printing within 6 seconds + printing time. "High-Speed C
Don't throw your BGA's away, re-ball them with the Waveroom Plus Reballing system. This is a very user friendly system that is being used extensively by Contract Assembly houses. There are other systems, most much more expensive than this. None work
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
New Equipment | Cleaning Agents
VOC, CFC & HCFC FREE, Non-Aggressive, Very Mild Odor, Non Flammable, Non Toxic Certified as a “Clean Air Solvent” by the South Coast Air Quality Management District (SCAQMD), (AQP) is more than 95% water based and all ingredients are 100% active.
Easy to Use The A500 is the easiest to use fully automatic SPI system. The user simply loads a Gerber 274-X file for the PCB panel to be inspected, locks down the panel on the board holder and hits the play button. The system takes over from there,
New Equipment | Rework & Repair Equipment
Scotle-HR360 BGA Rework Station Products Description Scotle-HR360 BGA rework station is with 7.2 inch touch screen. Scotle-HR360 applies ARM32 bit microprocessor. Scotle-HR360 can generate profile automatically during reworking process. Scotle
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new ge
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
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