New SMT Equipment: solder bridges (Page 7 of 211)

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

FX-940 AOI - Automated In-line PCB Inspection

FX-940 AOI - Automated In-line PCB Inspection

New Equipment | Inspection

1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

NS Flux-Cored Lead Solder

NS Flux-Cored Lead Solder

New Equipment | Solder Materials

We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. This formula is designed so that the incidence of bridging is rare; likew

Nihon Superior Co., Ltd.

SAC305 Lead-Free Solder Alloy

SAC305 Lead-Free Solder Alloy

New Equipment | Solder Materials

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t

AIM Solder

Flexible PCB Assembly Services

Flexible PCB Assembly Services

New Equipment | Assembly Services

FPCB Assembly Fulfill flex PCB orders of 20 Layers Maximum High-quality, quick turn flexible printed circuit boards manufacturing services. With proven processes and a full range of services such as: Line Width/Space in the Inner Layer: 3/3mil

OurPCB Tech. LTD

XT-3 High-Resolution X-Ray Analyser

XT-3 High-Resolution X-Ray Analyser

New Equipment | Inspection

40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection

MatriX Technologies GmbH

Sn63/Pb37 Electropure™ High Purity Solder Alloy

Sn63/Pb37 Electropure™ High Purity Solder Alloy

New Equipment | Solder Materials

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solde

AIM Solder

Desktop overall-view AOI

Desktop overall-view AOI

New Equipment | Test Equipment

Desktop overall-view AOI: Product Detail: • Visual inspection for small PCB or components • Desktop design, compact size does not require installation • Fully compatible, retaining the AOI function with fixed camera

EKTION (SHENZHEN) TECHNOLOGY LIMITED

NanoSlic™ Gold Stencils

NanoSlic™ Gold Stencils

New Equipment | Printing

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.


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World's Best Reflow Oven Customizable for Unique Applications
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High Throughput Reflow Oven
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