The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Assembly Services
Hanwha HM520 SMT Assembly Line Hanwha HM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
New Equipment | Assembly Services
Hanwha XM520 SMT Assembly Line Hanwha XM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 100000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place m
New Equipment | Assembly Services
JUKI RS-1R SMT Assembly Line JUKI RS-1R SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machin
New Equipment | Assembly Services
JUKI RS-1R SMT Assembly Line JUKI RS-1R SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machin
New Equipment | Assembly Services
JUKI RS-1R SMT Assembly Line JUKI RS-1R SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machin
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Selective Soldering
The SolderStar WaveShuttle Selective has been specifically designed for daily testing and optimization of Mini-Wave Selective soldering machines. A specially configured array of titanium wave contact sensors are arranged on the underside of this meas
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil for solder paste printing on wafer. Wafer bumping stencils are characterized by a high number of apertures which lie close together in the size of 90µm x 110µm. A package density of up to 250000 openings is not unus
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
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