New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
First of all, It is so pleasure to contact your company We,TSM soldering machinery,are looking for distributor covering regional country for ele/semicon.industrial assembly application Let us introduce ourself shortly,if you can share business oppor
The MVP Selecta is a new product designed to complement your selective solder system and allows you to inspect the components soldered by your bottom-side soldering solution. MVP’s Selecta allows for full bottom-side inspection of all wave and reflow
Full Viscom 2.5D defect detection coverage for placement and solder joint inspection. Extremely reliable, proven inspection for reflow, pre-reflow, wave and selective soldering Revolutionary simplicity in AOI operation with vVision Scalable came
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an
Solder Paste Inspection and Measurement System, providing 100 % 2 D and sampled 3 D coverage.
Material: FR-4 Layer Coverage: 2L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Material: FR4 Layer Coverage: 6L Thickness: 1.6MM Surface Technique: HAL Leadfree Line Width/Space: 6mil/6mil Solder Mask Color: Green Special:BGA.Impendance
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