Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
SUPERIOR VISION 4000 � SUPERIOR SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 4000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs, t
SUPERIOR VISION 6000 � UNRIVALED SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 6000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs,
New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
New Equipment | Assembly Services
1). Bergquist Thermal Clad aluminium backed, 2). LTI-04503, MP-06503, ML-11006, HT-07006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 1oz 5). Black solder mask/no ident 6). CNC rout outline 7). Im
New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
