General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
BGA, flex-BGA, uBGA, CBGA and CSP Dummy Components with daisy chain for solder practice and temperature profiling.
QFP and TQFP Dummy Components with daisy chain for solder practice and temperature profiling.
MLF leadless CSP with daisy chain for solder practice and temperature profiling.
Accurate regulation Soldering profiles Stations with stand http://www.selen.hr/pokaz_kategorie.php?cid=51
Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying. Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature
New Equipment | Soldering - Other
Whether batch or inline, atmospheric or vacuum, the SolderStar solution for Vapor Phase machines allows engineers to understand and control their production vapour phases processes. Vapour phase soldering is not a new process, and with advanced machi
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
Printers; Pick'n'Place; Reflow;Soldering; Conveyors & Material Handling; AOI; Odd form Placement; X-Ray & Rework; Precision Cleaners;ESD furniture;Fixtures/Pallets; Laser Marking; Inserters; Profilers; Solder Paste & flux;
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
