New SMT Equipment: solder flow (Page 6 of 7)

AKS Ultrasonic Stencil Cleaner

AKS Ultrasonic Stencil Cleaner

New Equipment | Cleaning Equipment

Maximize your stencil cleaning results! AKS Stencil Cleaner provides microscopic, ultrasonic removal of solder paste and post-solder flux buildup. All-in-one cleaning All “workstations” included in one compact unit, minimizing required floorspace.

Aqua Klean Systems

DEK Galaxy - Screen Printer

DEK Galaxy - Screen Printer

New Equipment | Printing

Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno

ASM Assembly Systems (DEK)

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

New Equipment | Rework & Repair Equipment

Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy. With a high level of process modularity, the system supports

Finetech

S3088 ultra – High-speed 3D AOI for the Most Reliable Assembly Inspection

S3088 ultra – High-speed 3D AOI for the Most Reliable Assembly Inspection

New Equipment | Inspection

S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ

Viscom AG

M.O.L.E.® MAP Thermal Profiler Software

M.O.L.E.® MAP Thermal Profiler Software

New Equipment | Software

M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E

Electronic Controls Design Inc. (ECD)

SMT reflow oven R50CD with mesh belt and pin chain

SMT reflow oven R50CD with mesh belt and pin chain

New Equipment | Soldering Robots

Model  R50CD (Computer) Heating zones  Upper 5/lower 5 Length of heating zone 1730mm PCB width  Chain 300mm, mesh 350mm Conveyor chain width range  50-300mm PCB direction  L→R  or (R→L) Chain fixing Front fix(back fix is optional) Conveyor hei

Beijing Glichn S&T Development Co.,Ltd

StencilLaser G 6080

StencilLaser G 6080

New Equipment | Printing

Custom libraries for automated aperture modifications Special cutting routines One-click data matrix code or barcode generation for stencil marking Fast Setup: Loose Foils and Framed Stencils The LPKF StencilLaser G 6080 automatically ad

LPKF Laser & Electronics

LPT Series (Large Panel Technology) In-Line Stencil Printers

LPT Series (Large Panel Technology) In-Line Stencil Printers

New Equipment | Printing

World's Largest Print Area Stencil Printers for Ultra Fine pitch solder paste printing Models with 24" x 24", 30" x 32", 30" x 38", 30" x 46", and 30" x 60" Print Areas Windows NT-Based Operating System Accu-Lign Series 3 Automatic Visio

Surface Mount Techniques

Henkel Electronics Assembly Film Adhesives

Henkel Electronics Assembly Film Adhesives

New Equipment | Materials

The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli

Henkel Electronic Materials

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