New Equipment | Rework & Repair Equipment
New MX-500UF Soldering and Rework System with UltraFine Soldering Hand-piece for soldering and touch-up of very small components, restricted access or high density component packaging on a PCB. The system utilizes SmartHeat® Technology, wherein each
New Equipment | Rework & Repair Equipment
New Dual Port Simultaneous Soldering and Rework System highly effective for soldering applications including: lead-free, high mass components or boards, thermally sensitive components requiring low operating temperature, high volume production solder
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Selective solder fixtures protect bottom side SMT components & eliminate the risk of loosing parts in the solder. Our unique designs will eliminate skipping and bridging. No need to tape areas which reduces operator time and speeds up your line.
New Equipment | Rework & Repair Equipment
Metcal’s MX-500 Soldering and Rework System has been reimagined, adding features and a new look to a bench top icon. The system utilizes SmartHeat® Technology, wherein each cartridge is equipped with a self-regulating heater which ‘senses’ its own t
New Equipment | Solder Materials
We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.
New Equipment | Rework & Repair Equipment
New Dual Port Simultaneous Desoldering System designed for plated-through-hole component desoldering. The easy-to-grip handle allows the task to be completed quickly and comfortably. This "shop-air" hand tool, in combination with the new dual simulta
New Equipment | Rework & Repair Equipment
The BEST micro pad repair kit includes the tools and materials needed to reliably replace lifted or damaged surface mount and BGA pads on PCBs. This kit includes 3 different tin plated circuit frame patterns, which offer nearly 3 times as many useabl
Technic Releases TechniPad 7611 New high-performance pure palladium for TechniPad ENEPIG offers a consistent deposit with less maintenance Cranston, RI, USA - Technic has announced the release of TechniPad 7611, an electroless process that deposit
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
Used for Coaxial measurements. The probes are 50 ohm impedance and the ground shield extends to test pad. Patented Design
