New SMT Equipment: solder insufficiency (Page 1 of 2)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

FX Series AOI

FX Series AOI

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

BX AOI - Benchtop Automated Optical Inspection

BX AOI - Benchtop Automated Optical Inspection

New Equipment | Inspection

500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

FX-940 AOI - Automated In-line PCB Inspection

FX-940 AOI - Automated In-line PCB Inspection

New Equipment | Inspection

1.5 million components per hour Maximum Board Size: 20” x 21” (500mm x 525mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option

Nordson YESTECH

M1m AOI - Automated Optical Inspection for Microelectronics

M1m AOI - Automated Optical Inspection for Microelectronics

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

M1 Series AOI - In-Line Automated Inspection

M1 Series AOI - In-Line Automated Inspection

New Equipment | Inspection

3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot

Nordson YESTECH

Nikko Power Cyclone 3D PCB Cleaner

Nikko Power Cyclone 3D PCB Cleaner

New Equipment | Cleaning Equipment

Inline, quickly and efficiently removes dust and particulates from PCB surface before solder application. Recently, there has been a dramatic increase in the number of customers implementing PCB cleaners before solder application in the mounting pr

Nix of America

X3 3D X-Ray - Automated In-line X-Ray Inspection System

X3 3D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol

Nordson YESTECH

X2 2D X-Ray - Automated In-line X-Ray Inspection System

X2 2D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i

Nordson YESTECH

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