New SMT Equipment: solder joint partially reflowed (Page 1 of 9)

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

New Equipment | Rework & Repair Equipment

Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a

BEST Inc.

Durostone sheet for wave solder pallet

Durostone sheet for wave solder pallet

New Equipment | Materials

Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste printing, SMT process, reflow soldering and wave solderi

Prior Plastic Co., LTD.

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

SMT 256B Solder Joint Encapsulant

SMT 256B Solder Joint Encapsulant

New Equipment | Materials

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes

YINCAE Advanced Materials, LLC.

SMT 266 Solder Joint Encapsulant

SMT 266 Solder Joint Encapsulant

New Equipment | Materials

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat

YINCAE Advanced Materials, LLC.

BP 256 Ball Attach Adhesive

BP 256 Ball Attach Adhesive

New Equipment | Materials

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During

YINCAE Advanced Materials, LLC.

SMT 256EP Solder Joint Encapsulant Paste

SMT 256EP Solder Joint Encapsulant Paste

New Equipment | Materials

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and

YINCAE Advanced Materials, LLC.

SJ-10

New Equipment |  

Solder Joint Inspection and Measurement System, for both pre and post reflow applications

MV Technology (acquired by Agilent Technologies )

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

S3016 - Bottom-Up AOI

S3016 - Bottom-Up AOI

New Equipment | Inspection

Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed

Viscom AG


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