New SMT Equipment: solder mask bubbles (Page 8 of 11)

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

AKS Ultrasonic Stencil Cleaner

AKS Ultrasonic Stencil Cleaner

New Equipment | Cleaning Equipment

Maximize your stencil cleaning results! AKS Stencil Cleaner provides microscopic, ultrasonic removal of solder paste and post-solder flux buildup. All-in-one cleaning All “workstations” included in one compact unit, minimizing required floorspace.

Aqua Klean Systems

SJ Inno Tech HP-520SPI  - Screen Printer with 3D SPI

SJ Inno Tech HP-520SPI - Screen Printer with 3D SPI

New Equipment | Printing

Advanced Solder Paste Printer with 2D and 3D SPI On-Board Standard Features Include: 3D Solder Paste Inspection 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Full Process Control Programmable

Apex Factory Automation

Polyimide(kapton) tape-High quality, Best price

Polyimide(kapton) tape-High quality, Best price

New Equipment |  

Kapton®tapes are polyimide polymers in the form of a film. Kapton?polyimide tapes are also known as high temperature tape or polyimide tape. Some of the characteristics of the Kapton®polyimide tape are: It maintains an excellent physical and electri

Hefei Bajin Trading Co., Ltd.

Aluminium PCB

Aluminium PCB

New Equipment |  

Aluminium PCB Materials: Aluminium.This material is made in China and has big competitive price. Layer Number: 1 Board thickness: 1.0mm Surface technique: Pb free HAL Minimum hole size: 0.30mm Minimum Line/Space: 0.25mm/0.25mm Solder mask: Blac

Cirket Electronics Co.,Ltd

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

SMT PRODUCTS & SERVICES OFFERED BY EMC GLOBAL TECHNOLOGIES INC.

SMT PRODUCTS & SERVICES OFFERED BY EMC GLOBAL TECHNOLOGIES INC.

New Equipment | Assembly Services

WORK BOARD HOLDERS TOOLING TO HOLD PRINTED CIRCUIT BOARD IN PLACE OVER INSERTION & PICK AND PLACE MACHINE SELECTIVE SOLDER PALLETS TO ELIMINATE MANUAL MASKING OF PRINTED CIRCUIT BOARD'S BEFOR THEY GO OVER WAVE. PALLETS HELP WITH DEFECTS AND E

EMC Global Technologies, Inc.

Martin MiniOven-05 - Desktop Reflow Oven

Martin MiniOven-05 - Desktop Reflow Oven

New Equipment | Rework & Repair Equipment

Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos

MARTIN (a Finetech company)

1mil, 3mils film Polyimide(Kapton) Tape

1mil, 3mils film Polyimide(Kapton) Tape

New Equipment |  

Polyimide tape can either be amber or clear in color, and the film thickness ranges 1 and 3 mils while the adhesive may range from 1 to 2 mils thick. It may be double sided, and the adhesive may be silicone or acrylic based. Anti-static Polyimide t

Suzhou Wei-li Tape Co.,Ltd

SPR-20 Benchtop Manual SMT Stencil Printer

SPR-20 Benchtop Manual SMT Stencil Printer

New Equipment | Printing

Cost effective manual stencil printer designed for low to medium volume assembly production runs. The SPR-20 benchtop, manual stencil printer is designed for low to medium volume assembly runs. Precise X,Y, Z, and theta axis controls allow for accur

DDM Novastar Inc


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