8-layer PCB with impedance control. Surface Finish: Immersion Gold
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides dimensionally stable support platform for PCB * Protects SMT components from heat or thermal shock * Reduce/eliminate manual labor for hand masking operation, glue dotting, and hand soldering * Reduce solder defects (ex. Bridges and skips)
Design For Manufacturability And Yield Enhancement. The Design for Manufacturability (DFM) engine searches for fabrication issues and discovers areas where yields may be increased. GraphiCode's Contour Technology produces fast and accurate results f
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
We supply bare printed circuit boards provided to us by our offshore manufacturing partners. Our partners have been fully researched and carefully selected, and are ISO certified and UL-approved. Single-Sided board Double-sided board Multilayer
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
Lean, high speed, screen printing. Adaptable to dual lane for faster production, the Panasonic SPG can also handle large boards. A great companion for the AM100 Placement Machine Panasonic's SPG high-speed screen printing machine is the ultimate
1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
Material: FR4 Layer Coverage: 6L Thickness: 1.6MM Surface Technique: HAL Leadfree Line Width/Space: 6mil/6mil Solder Mask Color: Green Special:BGA.Impendance
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