New Equipment | Board Handling - Pallets,Carriers,Fixtures
Selective solder fixtures protect bottom side SMT components & eliminate the risk of loosing parts in the solder. Our unique designs will eliminate skipping and bridging. No need to tape areas which reduces operator time and speeds up your line.
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
Lean, high speed, screen printing. Adaptable to dual lane for faster production, the Panasonic SPG can also handle large boards. A great companion for the AM100 Placement Machine Panasonic's SPG high-speed screen printing machine is the ultimate
1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
Material: FR4 Layer Coverage: 6L Thickness: 1.6MM Surface Technique: HAL Leadfree Line Width/Space: 6mil/6mil Solder Mask Color: Green Special:BGA.Impendance
FR-4 Material 2. 4 mm Thickness 3OZ base Cu 10 Layers Immersion Gold Surface Treatment Green Solder Mask
Material: FR4 Layer Coverage: 12L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
FR-4 Material 1.6 mm Thickness 12 Layers Immersion Gold Surface Treatment 0.2mm Drill Green Solder Mask Color BGA, Impedance Control
1. FR-4 material, 1 oz copper finished 2. 6-12 layers, 5mm thick board 3. Green solder mask /white silk screen. 4. Blind/buried vias required. 5. Hot air level Pb free 6. Application: motor, medical equipment, industrial products.
1. Bergquist metal backed 2. 1.6mm thick, single sided, 1oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: LED prodcuts, High power supply, Computers etc
