1. Thermagon metal backed 2. 1.6mm thick, single sided, 1 oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: High power supply, Computers, Industrial power equipment, LED
1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish
Base material: FR4 Layer count: four layer Board thickness: 1.6mm Copper thickness: 2 oz Surface finish: Immersion Gold Solder mask color: Green Sizes: 262 x 185/1up
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,
New Equipment | Test Equipment
Auto-SIR – Performs Surface Insulation Resistance testing in accordance with all major international standards: IEC 61189-5, ISO 9455-17, IPC-TM-650, BELCORE GR-78-CORE, DIN German & JIS Japanese standards. Includes elements of ANSI/IPC-JSTD001C (as
Dual Lane Screen Printing. The SPD (screen printer dual) features high-speed simultaneous production of two boards of the same type or two completely different products. Non-stop model changeover capability allows changeover of one stencil while th
New Equipment | Board Handling - Pallets,Carriers,Fixtures
With MB Manufacturing’s continuous improvement strategy we have developed the ultimate selective solder fixture out of a combination of titanium and composite, incorporating the latest in flow technologies to eliminate skips and bridges on a selectiv
1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).
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