New SMT Equipment: solder mask color (Page 1 of 18)

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Middle Size Lead Free SMT Reflow Oven for LED A600

Middle Size Lead Free SMT Reflow Oven for LED A600

New Equipment | Reflow

Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati

I.C.T ( Dongguan ICT Technology Co., Ltd. )

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

IPC J-STD-001F Standard

IPC J-STD-001F Standard

New Equipment | Education/Training

IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies.  The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001

BEST Inc.

ProMask - Instant solder mask for prototype PCB’s

ProMask - Instant solder mask for prototype PCB’s

New Equipment | Solder Materials

An easy-to-use cost-effective solution for producing professionally masked PCBs in an in-house prototyping environment. Compact, quick and easy to use Professional finish and perfect soldering Four simple steps to a professional result

LPKF Laser & Electronics

PCB-02

PCB-02

New Equipment |  

Material: FR-4 Layer Coverage: 2L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green

Shenzhen Longkun Technology Co.,Ltd

8 Layer Mobile PCB

8 Layer Mobile PCB

New Equipment | Components

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder

Headpcb

6layer-PCB-1

6layer-PCB-1

New Equipment |  

Material: FR4 Layer Coverage: 6L Thickness: 1.6MM Surface Technique: HAL Leadfree Line Width/Space: 6mil/6mil Solder Mask Color: Green Special:BGA.Impendance

Shenzhen Longkun Technology Co.,Ltd

12layer-pcb

12layer-pcb

New Equipment |  

Material: FR4 Layer Coverage: 12L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green

Shenzhen Longkun Technology Co.,Ltd

12layers-pcb2

12layers-pcb2

New Equipment |  

FR-4 Material 1.6 mm Thickness 12 Layers Immersion Gold Surface Treatment 0.2mm Drill Green Solder Mask Color BGA, Impedance Control

Shenzhen Longkun Technology Co.,Ltd

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Electronic Solutions

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