New SMT Equipment: solder mask dam (Page 10 of 26)

Different PCB's in 1 PANEL

Different PCB's in 1 PANEL

New Equipment | Components

1). 14 different PCB's in one Panel within 400 x 500mm 2). Same material and Thickness. 2). FR-4 Material, Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). Hot air level finish

Bicheng Enterprise Company

4 layer pcb Immersion gold

4 layer pcb Immersion gold

New Equipment | Printing

Base material: FR4 Layer count: four layer Board thickness: 1.6mm Copper thickness: 2 oz Surface finish: Immersion Gold Solder mask color: Green Sizes: 262 x 185/1up

Shenzhen Aobo Technology Co.,Ltd

10 Layer Gold fingers PCB

10 Layer Gold fingers PCB

New Equipment | Components

Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi

Headpcb

6 Layer I/G, Impedance PCB

6 Layer I/G, Impedance PCB

New Equipment | Components

Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability

Headpcb

1 Layer CEM-1 CTI600 PCB

1 Layer CEM-1 CTI600 PCB

New Equipment | Components

Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,

Headpcb

Auto-SIR  Surface Insulation Resistance Test

Auto-SIR Surface Insulation Resistance Test

New Equipment | Test Equipment

Auto-SIR – Performs Surface Insulation Resistance testing in accordance with all major international standards: IEC 61189-5, ISO 9455-17, IPC-TM-650, BELCORE GR-78-CORE, DIN German & JIS Japanese standards.  Includes elements of ANSI/IPC-JSTD001C (as

Ascentech LLC

Andes Multipoint Selective Soldering System

Andes Multipoint Selective Soldering System

New Equipment | Selective Soldering

Uses customized and dedicated fixtures/nozzles which eliminates the use of masking tape Lead-free compatible The number of components on the PCB will not affect the tact time Able to control under the temperature range of ±1°C User-friendly desig

Seika Machinery, Inc.

Panasonic SPD Dual-Lane Screen Printer

Panasonic SPD Dual-Lane Screen Printer

New Equipment | Printing

Dual Lane Screen Printing. The SPD (screen printer dual) features high-speed simultaneous production of two boards of the same type or two completely different products. Non-stop model changeover capability allows changeover of one stencil while th

Panasonic Factory Solutions Company of America (PFSA)

Quick turn PCB Prototypes

Quick turn PCB Prototypes

New Equipment | Components

1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).

Bicheng Enterprise Company

Fixtures & Tooling For PCBA

New Equipment | Other

EMC Global Technologies At EMC Global Technologies  we manufacture fixtures and tooling for the processing of printed circuit board assemblies. FIXTURES                                                Wave Solder Pallets     Dedicated or Adjustabl

EMC Global Technologies, Inc.


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