New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
New Equipment | Assembly Services
The board is designed by customer and it's for Network interface controller. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 8 Layer HDI PCBA board Material: FR-4 TG180, Shengy
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
Supplier: Shenzhen Grande Electronic Layers: 4 Application: General Industrial Equipment PCB Prototype/ China HASL PCB Manufacturer PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: HASL Testing: 100% E-test Package: Vacuum packing Lead
Supplier: Shenzhen Grande Electronics Layers: 4 Application: Stone Crusher PCB Prototype and Manufacturing Process | Grande PCB & PCBA PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing L
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Supplier: Shenzhen Grande Electronics Layers: 4 Application: Grande - Automobile PCB Prototyping and Manufacturing PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 da
Supplier: Shenzhen Grande Electronic Layers: 4 Application: Welding Machine Immersion Gold PCB Prototype / PCB Manufacturer China PCB Parameter: FR-4/HTG150 Thickness:1.6mm Surface Treatment: Immersion Gold Testing: 100% E-test Package: Vacuum packi
New Equipment | Board Handling - Storage
Supplier: Grande Electronics Layers: 4 Application: Pager Electronic Manufacturing | Fusion PCB Fabrication & Prototype PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Supplier: Grande Layers: 4 Application: Asset Tracking Device and System Turnkey PCB Solution - Printed Circuit Board Manufacturer PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: HASL Testing: 100% E-test Package: Vacuum packing Lead
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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