New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
Dual Lane Screen Printing. The SPD (screen printer dual) features high-speed simultaneous production of two boards of the same type or two completely different products. Non-stop model changeover capability allows changeover of one stencil while th
New Equipment | Coating Materials
Technic Releases TechniFlex LCL1000F/423M New Flexible Black Soldermask for Direct Imaging Cranston, RI, USA - Technic has announced the release of TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Formic Acid Horizontal Reflow Oven H5 Features Formic Acid Horizontal Reflow Oven H5: 1, high vacuum degree: 0.01 mbar high vacuum, vacuum degree of cavity numerical real-time display, and can control and adjust 2, vacuum pumping speed, after 50 m
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