New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
New Equipment | Test Equipment
Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS+ 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 25mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Education/Training
Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of surface mount solder connections. With 44 pages and a compact 5.5 x 8.5 inch (14 x
New Equipment | Education/Training
Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With 30 pages and a compact size at 5.5 x 8.5 inch
New Equipment | Selective Soldering
For flexible miniwave soldering processes and dip soldering processes that guarantee short cycle times. The high-end system which leaves nothing to be desired. Maximum Power for Your Selective Production. SEHO PowerSelective is featured with an ou
New Equipment | Solder Materials
Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void,
New Equipment | Soldering Robots
Supports Massive Production With Fast Circular Motion. The 5-axis SCARA soldering robot for inline, UNIX-700FH features a fast maximum speed of 7,128 mm/sec with high repeatability, accuracy and rigidity. The 700FH features an adjustable stroke leng
