is a water-based cleaning medium utilizing our unique technology, designed to remove solder pastes and SMT adhesives from from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes and SMT adhesives from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
We offer PCB assembley from 12 SMT modern lines with strong effective Solder Paste AOI Japanese inspection machine. We can do high volume production .
3D Solder Paste Inspection System (SPI) Color Image Processing 12um, 18um & 20um Resolution Accomodates M,L & XL PCB Sizes
New Equipment | Cleaning Equipment
Gensonic Ultr-Sanic hand-held stencil cleaning Kit Compact and portable 2-3 minute cleaning cycle Cleans all solder pastes
VisionPro HSi is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a
New Equipment | Solder Paste Stencils
MLT stainless steel and non-metal stencils (i.e. Kapton) are laser fabricated for applying solder paste, flux, solderballs, to circuit boards, wafers, and components for prototypes, volume production, and PCB rework.
