New Equipment | Solder Paste Stencils
Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste
Cookson Electronics Assembly Materials is the world leader in the development, manufacturing and sales of innovative materials used in the electronic assembly process. Cookson Electronics Assembly Materials is a full line supplier of Solder Paste, St
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
New Equipment | Rework & Repair Equipment
The JT-2A is a high power hot air station used for desoldering all types of SMDs. Its powerful heater enables quick and safe desoldering of even the biggest QFPs and PLCCs. In addition, it desolders small and medium sized BGA’s in a very reduced ti
New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
New Equipment | Assembly Services
Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
This high efficiency unit is capable of a wide range of consumer or industrial applications. High Performance and Cost Effective, Flexible Changeover and Capable of M/L size PWB's for Flexibility, Optional PCB support up to 27.6" X 16" or 20" X 18",
