New SMT Equipment: solder paste senju 3 (Page 1 of 28)

SMT Dispensing Pumps for Integration

SMT Dispensing Pumps for Integration

New Equipment | Dispensing

Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto

New Equipment | Printing

SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

DV-7000 Heli-Flow Pump

DV-7000 Heli-Flow Pump

New Equipment | Dispensing

The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,

ASYMTEK Products | Nordson Electronics Solutions

Spectrum II S2-900 Series Fluid Dispensers

Spectrum II S2-900 Series Fluid Dispensers

New Equipment | Dispensing

The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability

ASYMTEK Products | Nordson Electronics Solutions

ASM DEK TQ SMT Stencil Printer

ASM DEK TQ SMT Stencil Printer

New Equipment | Pick & Place

2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time:5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm   ASM DEK TQ SMT Stencil Prin

Qersa Technology Co.,ltd

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

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