Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
This high efficiency unit is capable of a wide range of consumer or industrial applications. High Performance and Cost Effective, Flexible Changeover and Capable of M/L size PWB's for Flexibility, Optional PCB support up to 27.6" X 16" or 20" X 18",
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Discover the Industry's Highest Performing True3D SPI Solutions FIND OUT WHY SO MANY MANUFACTURERS IN NORTH AND SOUTH AMERICA RELY ON KOH YOUNG SPI SOLUTIONS Did you know a majority of printed circuit board (PCB) defects occur during solder printin
Advanced Solder Paste Printer with 2D SPI On-Board. Auto screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Ful
Advanced Dual Lane Solder Paste Printer with 2D SPI On-Board. Dual lane screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Proce
Advanced LED Solder Paste Printer with 2D SPI On-Board LED screen printer with Advanced Vision System for all PCB types Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Process Control
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
New Equipment | Solder Materials
Proposal Pro Contra Vaporphase OT2 SCAN-Ge XF3+ Large melting range Anti-Tombstoning Dull solder joints
