New SMT Equipment: solder paste thickness (Page 14 of 39)

SMT 8200

New Equipment |  

The SMT 8200SPI and 8200CPI are laser-based inspection systems. The 8200 meets the most demanding cycle time requirements with 100% inspection of solder paste or component placement. Using a 3D scanning laser, the 8200 can detect solder paste volum

GSI Group

SUNEAST

SUNEAST

New Equipment |  

PROSEM Technology Inc. also represents SUNEAST, a Hong Kong based SMT equipment manufacturer for their Solder Paste Printers and Reflow Ovens. the Solder Paste Printers cover the complete range from Semi-Automatic without vision, through Semi-Automat

PROSEM Technology India Private Ltd

Bar Solder for Electronic Assembly

Bar Solder for Electronic Assembly

New Equipment | Solder Materials

Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f

Stellar Technical Products

SPI 2500 3D Solder Paste Inspection System

SPI 2500 3D Solder Paste Inspection System

New Equipment | Inspection

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V

PARMI

Henkel Electronics Assembly Film Adhesives

Henkel Electronics Assembly Film Adhesives

New Equipment | Materials

The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli

Henkel Electronic Materials

Polyimide kapton tape

Polyimide kapton tape

New Equipment | Materials

Tape KD851/852 is a polyimide film-backed silicone adhesive tape with high temperature resistant. Application Mask for printed circuit boards during wave solder or solder dip process. Features:KD851 Total Tape T

SHENZHEN KHJ TECHNOLOGY CO.,LTD

8 Layer Mobile PCB

8 Layer Mobile PCB

New Equipment | Components

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder

Headpcb

2 Layer CEM-3 pcb

2 Layer CEM-3 pcb

New Equipment | Components

Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F

Headpcb

PCB-02

PCB-02

New Equipment |  

Material: FR-4 Layer Coverage: 2L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green

Shenzhen Longkun Technology Co.,Ltd

6-layer-Carbon-Ink-PCB

6-layer-Carbon-Ink-PCB

New Equipment |  

High Tg FR4 Material 2.0 mm Thickness 6 Layers Immersion Gold Surface Treatment Green Solder Mask Carbon Ink

Shenzhen Longkun Technology Co.,Ltd


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