Stencils, metal mask tools used for the deposit of solder paste onto PC Board before component placement. Please call for the best process for your requirements.
General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
Used on SMT machinery i.e. DEK, MPM, EKRA, Panasonic etc., to clean residual solder paste
Solder Paste Inspection and Measurement System, providing 100 % 2 D and sampled 3 D coverage.
Stencils For Solder Paste Or Adhesive Printing. Chemically Etched, Laser Cut Or Combination Laser/Chem.
Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and
is a water-based cleaning medium utilizing our unique technology, designed to remove solder pastes and SMT adhesives from from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes and SMT adhesives from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
