We offer PCB assembley from 12 SMT modern lines with strong effective Solder Paste AOI Japanese inspection machine. We can do high volume production .
3D Solder Paste Inspection System (SPI) Color Image Processing 12um, 18um & 20um Resolution Accomodates M,L & XL PCB Sizes
New Equipment | Cleaning Equipment
Gensonic Ultr-Sanic hand-held stencil cleaning Kit Compact and portable 2-3 minute cleaning cycle Cleans all solder pastes
VisionPro HSi is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a
New Equipment | Solder Paste Stencils
MLT stainless steel and non-metal stencils (i.e. Kapton) are laser fabricated for applying solder paste, flux, solderballs, to circuit boards, wafers, and components for prototypes, volume production, and PCB rework.
New Equipment | Fabrication Services
Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger Solder mask color: green Size: 125.09 x 95.25/1up SMT SMD, 230 DIP and 4 pieces component
MODEL NAME:HP-350M ;HP-520S ; HP-680S ; HP-850S ; HP-1000S Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various P
World's Largest Print Area Stencil Printers for Ultra Fine pitch solder paste printing Models with 24" x 24", 30" x 32", 30" x 38", 30" x 46", and 30" x 60" Print Areas Windows NT-Based Operating System Accu-Lign Series 3 Automatic Visio
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
