New SMT Equipment: solder paste viscosity kcps (Page 1 of 1)

NC-559-ASM No-Clean Solder Paste

NC-559-ASM No-Clean Solder Paste

New Equipment | Solder Materials

High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing

AMTECH

SN100C Solder Paste Products

SN100C Solder Paste Products

New Equipment | Solder Materials

FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec

FCT ASSEMBLY, INC.

AMTECH Tacky Paste Fluxes

AMTECH Tacky Paste Fluxes

New Equipment | Solder Materials

AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t

AMTECH

Slic Blade™ SMT Squeegee Blades

Slic Blade™ SMT Squeegee Blades

New Equipment | Printing

Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi

Fine Line Stencil, Inc.

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

Virtual Panel Tooling

Virtual Panel Tooling

New Equipment | Software

Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate

ASM Assembly Systems (DEK)

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