Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe
The LaserVision Mini SP3D system combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of the SMT stencil printing process. With its Windows® 7+ Pro OS and service free USB interface, the Mini SP3D system is e
New Equipment | Cleaning Equipment
smt stencil clean roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Most MPM pr
Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity whi
Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m. 4 zone convection 300 mm sold
Like all other VisionMaster equipment, the M500 uses advanced white light Moiré interferometry to build height data for every pixel in the view. VisionMaster honed this technology for SPI use and is the only manufacturer in the world deploying this
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profilin
0.15mm diameter). Adhesives Highest precision, even for delicate conductive adhesives with relatively large particles. Trouble free precision processing of abrasive media. Dispenser head heating prevents ‘stringing’. Potting Compou
Fast automatic inspection and high performance sample testing in one system. Two inspection concepts in one system - The best of two worlds. In modern SMT production, components such as BGA, QFN or QFP are gaining ground. Because their connectors a
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
