New SMT Equipment: solder paste volume excel (Page 8 of 11)

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

440-R SMT Cleaning Chemistry

440-R SMT Cleaning Chemistry

New Equipment | Cleaning Agents

440-R® SMT Detergent is the only stencil-cleaning chemistry verified by the U.S. EPA for specific parameters of environmental safety, user safety and cleaning efficiency and is the only stencil-cleaning chemistry to "survive the test of time". 440-R

Smart Sonic Stencil Cleaning Systems

AMTECH Tacky Paste Fluxes

AMTECH Tacky Paste Fluxes

New Equipment | Solder Materials

AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t

AMTECH

Henkel Electronics Assembly Film Adhesives

Henkel Electronics Assembly Film Adhesives

New Equipment | Materials

The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli

Henkel Electronic Materials

Yamaha YSP20 Dual-stage, Dual-stencil Printer

Yamaha YSP20 Dual-stage, Dual-stencil Printer

New Equipment | Printing

Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing to achieve an extremely fast printing speed and a variety of new and unique functions at the same time

Yamaha Motor IM America, Inc.

VisionMaster A500 - Automatic Benchtop 3D Solder Paste Inspection System

VisionMaster A500 - Automatic Benchtop 3D Solder Paste Inspection System

New Equipment | Inspection

Easy to Use The A500 is the easiest to use fully automatic SPI system. The user simply loads a Gerber 274-X file for the PCB panel to be inspected, locks down the panel on the board holder and hits the play button. The system takes over from there,

VisionMaster, Inc.

ScanSpection - Scanner Based In-Line & Desktop AOI

ScanSpection - Scanner Based In-Line & Desktop AOI

New Equipment | Inspection

Inspection of low, medium & high volume surface mount & thru hole technology. AOI Systems ScanSpection uses two basic algorithm groups to inspect component and soldering. The first algorithm checks the component related parameters at once, with the

AOI Systems

SPI HS60 - 3D Solder Paste Inspection System

SPI HS60 - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate

PARMI

SP700avi Inline SMT Stencil Printer

SP700avi Inline SMT Stencil Printer

New Equipment | Printing

The SP700avi stencil printer combines Speedprints commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production whilst incorporating the flexibility needed in

Speedprint Technology

PCB Manufacturing - China

PCB Manufacturing - China

New Equipment | Assembly Services

Outsourcing PC Boards. In order to stay competitive in today’s volatile economy, PNC has been offering offshore PC Board manufacturing capabilities from China since 1998. This allows PNC to handle all your manufacturing needs, regardless of size, qu

PNC Inc.


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