New SMT Equipment: solder pitch 1.27 (Page 1 of 10)

Reballing Preforms-EZReball™

Reballing Preforms-EZReball™

New Equipment | Rework & Repair Equipment

The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o

BEST Inc.

TP300 manual solder paste printer

TP300 manual solder paste printer

New Equipment | Printing

   TP300 is the simplest solution, the most compact-size and lowest-cost solder paste printer, it can be easy and accurate to print the solder paste on any board. Please see details below: 1). It is suitable for both single-sided and double-sided p

Tripper Technology Limited

BGA Reballing Services

BGA Reballing Services

New Equipment | Rework & Repair Equipment

Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a

Process Sciences, Inc.

Solder Paste

New Equipment |  

Tamura's Solder Paste RMA Series is a solder paste, which consists of RMA type flux satifies QQ-S-571E and spherical solder powder with very little oxide. So flux residue after soldering becomes high reliable coating with excellent insulation resist

Aoki Laboratories Ltd. [Solder Products Supplier]

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

SMT Step Stencils

SMT Step Stencils

New Equipment | Solder Paste Stencils

Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste

Stentech

eBall Lead-Free Solder Spheres

eBall Lead-Free Solder Spheres

New Equipment | Solder Materials

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch

Nihon Superior Co., Ltd.

NS Flux-Cored Lead Solder

NS Flux-Cored Lead Solder

New Equipment | Solder Materials

We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. This formula is designed so that the incidence of bridging is rare; likew

Nihon Superior Co., Ltd.

Pin Header connector

Pin Header connector

New Equipment |  

1) Our main products are : Pin Header Female Header Box Header Ejector Header Mini Jumper IDC connector(Flat Cable) Wafer connector Housing IC Socket connector 2) Key Specs (or Customize designed) : Type:SMT,Straight,Right-Angle style Main Pi

DongGuan JunJia Electronics Technology Co.,Ltd

main board connector

main board connector

New Equipment |  

1) Our main products are : Pin Header Female Header Box Header Ejector Header Mini Jumper IDC connector(Flat Cable) Wafer connector Housing IC Socket connector 2) Key Specs (or Customize designed) : Type:SMT,Straight,Right-Angle style Main Pi

DongGuan JunJia Electronics Technology Co.,Ltd

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